ZHCSLS8 August 2020 DRV5825P
PRODUCTION DATA
| THERMAL METRIC(1) | DRV5825P VQFN (RHB) 32 PINS |
UNIT | |||
|---|---|---|---|---|---|
| JEDEC STANDARD 4-LAYER PCB |
|||||
| RθJA | Junction-to-ambient thermal resistance | 30 | °C/W | ||
| RθJC(top) | Junction-to-case (top) thermal resistance | 19.1 | °C/W | ||
| RθJB | Junction-to-board thermal resistance | 9.9 | °C/W | ||
| ψJT | Junction-to-top characterization parameter | 0.2 | °C/W | ||
| ψJB | Junction-to-board characterization parameter | 10.5 | °C/W | ||