ZHCSK51 August 2019 DRV5057-Q1
PRODUCTION DATA.
| THERMAL METRIC(1) | DRV5057-Q1 | UNIT | |
|---|---|---|---|
| SOT-23 (DBZ) | |||
| 3 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 170 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 66 | °C/W |
| RθJB | Junction-to-board thermal resistance | 49 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 1.7 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 48 | °C/W |