ZHCSIS4B September 2018 – April 2019 DRV5015-Q1
PRODUCTION DATA.
| THERMAL METRIC(1) | DRV5015-Q1 | UNIT | |
|---|---|---|---|
| SOT-23 (DBZ) | |||
| 3 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 356 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 128 | °C/W |
| RθJB | Junction-to-board thermal resistance | 94 | °C/W |
| YJT | Junction-to-top characterization parameter | 11.4 | °C/W |
| YJB | Junction-to-board characterization parameter | 92 | °C/W |