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ZHCSAX9A March 2013 – July 2015 DRV10963

PRODUCTION DATA.

封裝選項

機械數據 (封裝 | 引腳)

DSN|10
- MPDS330A

散熱焊盤機械數據 (封裝 | 引腳)

訂購信息

zhcsax9a_oa

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾ ⁽²⁾

		MIN	MAX	UNIT
	VCC Pin supply voltage	–0.3	6	V
	Motor phase pins (U, V, W)	–1	7.7	V
	Direction, speed indicator input, and speed input (FR, FGS, PWM)	–0.3	6	V
	Speed output (FG)	–0.3	7.7	V
T_J	Junction temperature	–40	150	°C
T_SDR	Maximum lead soldering temperature, 10 seconds		260	°C
T_stg	Storage temperature	–55	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltages are with respect to ground.

6.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±3000	V
V_(ESD)	Electrostatic discharge	Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾	±1500	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

		MIN	MAX	UNIT
VCC	VCC Pin supply voltage	2.1	5.5	V
U, V, W	Motor phase pins	–0.1	7	V
FR, FGS, PWM	Direction, speed indicator input, and speed input	–0.1	5.5	V
FG	Speed output	–0.1	7.5	V
T_J	Junction temperature	–40	125	°C

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		DRV10963	UNIT
		DSN (USON)
		10 PINS
R_θ_JA	Junction-to-ambient thermal resistance	40.9	°C/W
R_θ_JC(top)	Junction-to-case (top) thermal resistance	46.6	°C/W
R_θ_JB	Junction-to-board thermal resistance	15.8	°C/W
ψ_JT	Junction-to-top characterization parameter	0.5	°C/W
ψ_JB	Junction-to-board characterization parameter	16	°C/W
R_θ_JC(bot)	Junction-to-case (bottom) thermal resistance	2.9	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

(VCC = 5 V, T_A = 25°C unless otherwise noted)

PARAMETER		TEST CONDITION	MIN	TYP	MAX	UNIT
SUPPLY CURRENT
I_VCC	Operating current	PWM = V_CC, no motor connected		5.5		mA
I_{VCC_SLEEP}	Sleep current	PWM = 0 V		15	20	µA
UVLO
V_{UVLO_H}	Undervoltage threshold high			2	2.1	V
V_{UVLO_L}	Undervoltage threshold low		1.7	1.8		V
V_{UVLO_HYS}	Undervoltage threshold hysteresis		100	200	300	mV
INTEGRATED MOSFET
R_DSON	Series resistance (H+L)	V_CC= 5 V; I_OUT = 0.5 A		1	1.5	Ω
PWM
V_{IH_PWM}	Input high threshold		2.3			V
V_{IL_PWM}	Input low threshold				0.8	V
F_PWM	PWM input frequency	Duty cycle >0% and <100%	15		100	kHz
R_{PU_PWM_VCC}	PWM pin pullup resistor	Active Mode		50		kΩ
R_{PU_PWM_VCC}	PWM pin pullup resistor	Standby Mode		2		MΩ
T_SLEEP	Sleep entry time	PWM = 0 V		500		µs
FG
I_{OL_FG}	FG sink current	V_FG = 0.3 V	5			mA
I_{SC_FG}	FG short circuit current	V_FG = 5 V		13	25	mA
FGS and FR
V_{IH_FGS}	Input high threshold		2.3			V
V_{IL_FGS}	Input low threshold				0.8	V
V_{IH_FR}	Input high threshold		2.3			V
V_{IL_FR}	Input low threshold				0.8	V
R_{PU_FGS_VCC}	FGS pin pullup resistor	Active Mode		50		kΩ
R_{PU_FGS_VCC}	FGS pin pullup resistor	Standby Mode		2		MΩ
R_{PU_FR_VCC}	FR pin pullup resistor			500		kΩ
LOCK PROTECTION
T_{ON_LOCK}	Lock detect time			0.3		s
T_{OFF_LOCK}	Lock release time			5		s
CURRENT LIMIT
I_LIMIT	Soft current limit value			500		mA
SHORT CIRCUIT CURRENT PROTECTION [I_LIMIT [2:0] = 4
I_SHT	Short circuit current protection			1.8		A
THERMAL SHUTDOWN
T_SD	Thermal shutdown temperature			160		°C
T_{SD_HYS}	Thermal shutdown hysteresis			10		°C

6.6 Typical Characteristics

Figure 1. R_DS(ON) vs Power Supply at 25°C