ZHCSDF9 February   2015 DP83848-HT

PRODUCTION DATA.  

1. 1 特性
2. 2 應用范圍
3. 3 描述
4. 4 典型系統圖
5. 5 修訂歷史記錄
6. 6 Bare Die Information
7. 7 Specifications
   1. 7.1 Absolute Maximum Ratings
   2. 7.2 ESD Ratings
   3. 7.3 Recommended Operating Conditions
   4. 7.4 Thermal Information
   5. 7.5 DC Electrical Characteristics
   6. 7.6 AC Timing Specifications
   7. 7.7 Typical Characteristics
8. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagram
   3. 8.3 Feature Description
      1. 8.3.1 100BASE-TX Transmitter
         1. 8.3.1.1 Code-Group Encoding and Injection
         2. 8.3.1.2 Scrambler
         3. 8.3.1.3 NRZ to NRZI Encoder
         4. 8.3.1.4 Binary to MLT-3 Convertor
      2. 8.3.2 100BASE-TX Receiver
         1. 8.3.2.1  Analog Front End
         2. 8.3.2.2  Digital Signal Processor
            1. 8.3.2.2.1 Digital Adaptive Equalization and Gain Control
            2. 8.3.2.2.2 Base Line Wander Compensation
         3. 8.3.2.3  Signal Detect
         4. 8.3.2.4  MLT-3 to NRZI Decoder
         5. 8.3.2.5  NRZI to NRZ
         6. 8.3.2.6  Serial to Parallel
         7. 8.3.2.7  Descrambler
         8. 8.3.2.8  Code-Group Alignment
         9. 8.3.2.9  4B/5B Decoder
         10. 8.3.2.10 100BASE-TX Link Integrity Monitor
         11. 8.3.2.11 Bad SSD Detection
      3. 8.3.3 10BASE-T Transceiver Module
         1. 8.3.3.1  Operational Modes
            1. 8.3.3.1.1 Half Duplex Mode
            2. 8.3.3.1.2 Full Duplex Mode
         2. 8.3.3.2  Smart Squelch
         3. 8.3.3.3  Collision Detection and SQE
         4. 8.3.3.4  Carrier Sense
         5. 8.3.3.5  Normal Link Pulse Detection/Generation
         6. 8.3.3.6  Jabber Function
         7. 8.3.3.7  Automatic Link Polarity Detection and Correction
         8. 8.3.3.8  Transmit and Receive Filtering
         9. 8.3.3.9  Transmitter
         10. 8.3.3.10 Receiver
      4. 8.3.4 Reset Operation
         1. 8.3.4.1 Hardware Reset
         2. 8.3.4.2 Software Reset
   4. 8.4 Device Functional Modes
      1. 8.4.1 MII Interface
         1. 8.4.1.1 Nibble-Wide MII Data Interface
         2. 8.4.1.2 Collision Detect
         3. 8.4.1.3 Carrier Sense
      2. 8.4.2 Reduced MII Interface
      3. 8.4.3 10 Mb Serial Network Interface (SNI)
      4. 8.4.4 802.3u MII Serial Management Interface
         1. 8.4.4.1 Serial Management Register Access
         2. 8.4.4.2 Serial Management Access Protocol
         3. 8.4.4.3 Serial Management Preamble Suppression
   5. 8.5 Programming
      1. 8.5.1 Auto-Negotiation
         1. 8.5.1.1 Auto-Negotiation Pin Control
         2. 8.5.1.2 Auto-Negotiation Register Control
         3. 8.5.1.3 Auto-Negotiation Parallel Detection
         4. 8.5.1.4 Auto-Negotiation Restart
         5. 8.5.1.5 Enabling Auto-Negotiation via Software
         6. 8.5.1.6 Auto-Negotiation Complete Time
      2. 8.5.2 Auto-MDIX
      3. 8.5.3 PHY Address
         1. 8.5.3.1 MII Isolate Mode
      4. 8.5.4 LED Interface
         1. 8.5.4.1 LEDs
         2. 8.5.4.2 LED Direct Control
      5. 8.5.5 Half Duplex vs Full Duplex
      6. 8.5.6 Internal Loopback
      7. 8.5.7 BIST
   6. 8.6 Register Maps
      1. 8.6.1 Register Block
      2. 8.6.2 Register Definition
         1. 8.6.2.1 Basic Mode Control Register (BMCR)
         2. 8.6.2.2 Basic Mode Status Register (BMSR)
         3. 8.6.2.3 PHY Identifier Register 1 (PHYIDR1)
         4. 8.6.2.4 PHY Identifier Register 2 (PHYIDR2)
         5. 8.6.2.5 Auto-Negotiation Advertisement Register (ANAR)
         6. 8.6.2.6 Auto-Negotiation Link Partner Ability Register (ANLPAR) (BASE Page)
         7. 8.6.2.7 Auto-Negotiation Link Partner Ability Register (ANLPAR) (Next Page)
         8. 8.6.2.8 Auto-Negotiate Expansion Register (ANER)
         9. 8.6.2.9 Auto-Negotiation Next Page Transmit Register (ANNPTR)
      3. 8.6.3 Extended Registers
         1. 8.6.3.1  PHY Status Register (PHYSTS)
         2. 8.6.3.2  MII Interrupt Control Register (MICR)
         3. 8.6.3.3  MII Interrupt Status and Miscellaneous Control Register (MISR)
         4. 8.6.3.4  False Carrier Sense Counter Register (FCSCR)
         5. 8.6.3.5  Receiver Error Counter Register (RECR)
         6. 8.6.3.6  100 Mb/s PCS Configuration and Status Register (PCSR)
         7. 8.6.3.7  RMII and Bypass Register (RBR)
         8. 8.6.3.8  LED Direct Control Register (LEDCR)
         9. 8.6.3.9  PHY Control Register (PHYCR)
         10. 8.6.3.10 10Base-T Status/Control Register (10BTSCR)
         11. 8.6.3.11 CD Test and BIST Extensions Register (CDCTRL1)
         12. 8.6.3.12 Energy Detect Control (EDCR)
9. 9 Application and Implementation
   1. 9.1 Application Information
   2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
         1. 9.2.1.1 Clock Requirements
         2. 9.2.1.2 Magnetics
      2. 9.2.2 Detailed Design Procedure
         1. 9.2.2.1 TPI Network Circuit
         2. 9.2.2.2 Clock In (X1) Requirements
            1. 9.2.2.2.1 Oscillator
            2. 9.2.2.2.2 Crystal
         3. 9.2.2.3 Power Feedback Circuit
         4. 9.2.2.4 Power Down and Interrupt
            1. 9.2.2.4.1 Power-Down Control Mode
            2. 9.2.2.4.2 Interrupt Mechanisms
         5. 9.2.2.5 Energy Detect Mode
      3. 9.2.3 Application Curves
10. 10Power Supply Recommendations
11. 11Layout
    1. 11.1 Layout Guidelines
       1. 11.1.1 PCB Layer Stacking
    2. 11.2 Layout Example
    3. 11.3 ESD Protection
12. 12器件和文檔支持
    1. 12.1 文檔支持
       1. 12.1.1 相關文檔
    2. 12.2 商標
    3. 12.3 靜電放電警告
    4. 12.4 術語表
13. 13機械封裝和可訂購信息