ZHCSJN3B March   2019  – May 2022 DLP2000

PRODUCTION DATA  

1. 1 特性
2. 2 應(yīng)用
3. 3 說明
4. 4 Revision History
5. 5 Pin Configuration and Functions
6. 6 Specifications
   1. 6.1  Absolute Maximum Ratings
   2. 6.2  Storage Conditions
   3. 6.3  ESD Ratings
   4. 6.4  Recommended Operating Conditions
   5. 6.5  Thermal Information
   6. 6.6  Electrical Characteristics
   7. 6.7  Timing Requirements
   8. 6.8  System Mounting Interface Loads
   9. 6.9  Physical Characteristics of the Micromirror Array
   10. 6.10 Micromirror Array Optical Characteristics
   11. 6.11 Window Characteristics
   12. 6.12 Chipset Component Usage Specification
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Control Serial Interface
      3. 7.3.3 High Speed Interface
      4. 7.3.4 Timing
   4. 7.4 Device Functional Modes
   5. 7.5 Window Characteristics and Optics
      1. 7.5.1 Optical Interface and System Image Quality
         1. 7.5.1.1 Numerical Aperture and Stray Light Control
         2. 7.5.1.2 Pupil Match
         3. 7.5.1.3 Illumination Overfill
   6. 7.6 Micromirror Array Temperature Calculation
   7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
8. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
9. 9 Power Supply Recommendations
   1. 9.1 Power Supply Power-Up Procedure
   2. 9.2 Power Supply Power-Down Procedure
10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
11. 11Device and Documentation Support
    1. 11.1 第三方產(chǎn)品免責聲明
    2. 11.2 Device Support
       1. 11.2.1 Device Nomenclature
       2. 11.2.2 Device Markings
    3. 11.3 Related Links
    4. 11.4 接收文檔更新通知
    5. 11.5 支持資源
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 術(shù)語表
12. 12Mechanical, Packaging, and Orderable Information