ZHCSPR7E November 1998 – October 2022 CD54HC374 , CD54HC574 , CD54HCT374 , CD54HCT574 , CD74HC374 , CD74HC574 , CD74HCT374 , CD74HCT574
PRODUCTION DATA
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC | DW (SOIC) | N (PDIP) | PW (TSSOP) | UNIT | |
|---|---|---|---|---|---|
| 20 PINS | 20 PINS | 20 PINS | |||
| RθJA | Junction-to-ambient thermal resistance(1) | 109.1 | 84.6 | 131.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 76 | 72.5 | 72.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 77.6 | 65.3 | 82.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 51.5 | 55.3 | 21.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 77.1 | 65.2 | 82.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | °C/W |