ZHCSPU7G November 1998 – October 2022 CD54HC240 , CD54HC244 , CD54HCT240 , CD54HCT241 , CD54HCT244 , CD74HC240 , CD74HC241 , CD74HC244 , CD74HCT240 , CD74HCT241 , CD74HCT244
PRODUCTION DATA
- 1 特性
- 2 說(shuō)明
- 3 Revision History
- 4 Pin Configuration and Functions
-
5 Specifications
- 5.1 Absolute Maximum Ratings (1)
- 5.2 Recommended Operating Conditions
- 5.3 Thermal Information
- 5.4 Electrical Characteristics '240
- 5.5 Electrical Characteristics '241
- 5.6 Electrical Characteristics '244
- 5.7 Switching Characteristics '240
- 5.8 Switching Characteristics '241
- 5.9 Switching Characteristics '244
- 6 Parameter Measurement Information
- 7 Detailed Description
- 8 Power Supply Recommendations
- 9 Layout
- 10Device and Documentation Support
- 11Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- J|20
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購(gòu)信息
10.4 Electrostatic Discharge Caution
 |
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. |
| ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |