SLUSFH4A March 2025 – July 2025 BQ25858-Q1 , BQ25858B-Q1
PRODUCTION DATA
- 1
- 1 Features
- 2 Applications
- 3 Description
- 4 Device Comparison
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3
Feature Description
- 7.3.1 Device Power-On-Reset
- 7.3.2 Device Power-Up From Battery Without Input Source
- 7.3.3 Device Power Up From Input Source
- 7.3.4 Power Management
- 7.3.5 Bidirectional Power Flow and Programmability
- 7.3.6 Switching Frequency Dithering Feature
- 7.3.7 Integrated 16-Bit ADC for Monitoring
- 7.3.8 Status Outputs (PG, STAT and INT)
- 7.3.9
Protections
- 7.3.9.1
Voltage and Current Monitoring
- 7.3.9.1.1 VAC Over-voltage Protection (VAC_OVP)
- 7.3.9.1.2 VAC Under-voltage Protection (VAC_UVP)
- 7.3.9.1.3 Reverse Mode Over-voltage Protection (REV_OVP)
- 7.3.9.1.4 Reverse Mode Under-voltage Protection (REV_UVP)
- 7.3.9.1.5 DRV_SUP Under-voltage and Over-voltage Protection (DRV_OKZ)
- 7.3.9.1.6 REGN Under-voltage Protection (REGN_OKZ)
- 7.3.9.2 Thermal Shutdown (TSHUT)
- 7.3.9.1
Voltage and Current Monitoring
- 7.3.10 Serial Interface
- 7.4 Device Functional Modes
- 7.5 BQ25858-Q1/858B-Q1 Registers
-
8 Application and Implementation
- 8.1 Application Information
- 8.2
Typical Applications
- 8.2.1
Typical Application (Buck-Boost configuration)
- 8.2.1.1 Design Requirements
- 8.2.1.2
Detailed Design Procedure
- 8.2.1.2.1 ACUV / ACOV Input Voltage Operating Window Programming
- 8.2.1.2.2 Switching Frequency Selection
- 8.2.1.2.3 Inductor Selection
- 8.2.1.2.4 Input (VAC) Capacitor
- 8.2.1.2.5 Output (VBAT) Capacitor
- 8.2.1.2.6 Sense Resistor (RAC_SNS and RBAT_SNS) and Current Programming
- 8.2.1.2.7 Converter Fast Transient Response
- 8.2.1.3 Application Curves
- 8.2.2 Typical Application (Buck-only configuration)
- 8.2.1
Typical Application (Buck-Boost configuration)
- 8.3 Power Supply Recommendations
- 8.4 Layout
- 9 Device and Documentation Support
- 10Revision History
- 11Mechanical, Packaging, and Orderable Information
封裝選項
請參考 PDF 數據表獲取器件具體的封裝圖。
機械數據 (封裝 | 引腳)
- RRV|36
散熱焊盤機械數據 (封裝 | 引腳)
- RRV|36
訂購信息
8.4.2 Layout Example
Based on the above layout guidelines, the buck-boost PCB layout example top view is shown below including all the key power components.
Figure 8-26 PCB Layout Reference Example Top
ViewFor both input and output current sensing resistors, differential sensing and routing method are suggested and highlighted in figure below. Use wide trace for gate drive traces, minimum 20-mil trace width. Connect all analog grounds to a dedicated low-impedance copper plane, which is tied to the power ground underneath the IC exposed pad.
Figure 8-27 PCB Layout Gate Drive and Current Sensing Signal Layer Routing