ZHCSU23A October 2023 – December 2023 BQ25638
PRODUCTION DATA
| THERMAL METRIC(1) | BQ25638 | UNIT | |
|---|---|---|---|
| YBG (DSBGA) | |||
| 30 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 60 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 0.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 12.4 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.2 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 12.4 | °C/W |