ZHCSJX0A June 2019 – January 2021 BQ25125
PRODUCTION DATA
| THERMAL METRIC(1) | BQ25125 | UNIT | |
|---|---|---|---|
| YFP (DSBGA) | |||
| 25 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 60 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 0.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 12.0 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 12.0 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |