ZHCS958G June 2012 – September 2017 BQ24392
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機(jī)械、封裝和可訂購信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RSE|10
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
6 Specifications
6.1 Absolute Maximum Ratings
over –40℃ to 85℃ temperature range (unless otherwise noted)| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Input Voltage | VBUS | –2 | 28 | V |
| CHG_AL_N | –2 | 28 | V | |
| DM_HOST | –0.3 | 7 | V | |
| DP_HOST | –0.3 | 7 | ||
| GOOD_BAT | –0.3 | 7 | ||
| DP_CON | –0.3 | 7 | ||
| DM_CON | –0.3 | 7 | ||
| CHG_DET | –0.3 | 7 | ||
| Tstg | Storage temperature range | 65 | 150 | °C |
6.2 ESD Ratings
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±4000 | V |
| Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±1500 | |||
| IEC Contact discharge pins DP_CON and DM_CON to GND | ±8000 | |||
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions.
6.3 Recommended Operating Conditions
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| VBUS | 4.75 | 5.25 | V | |
| GOOD_BAT | 0 | VBUS | ||
| DM_HOST | 0 | 3.6 | ||
| DP_HOST | 0 | 3.6 | ||
| DM_CON | 0 | 3.6 | ||
| DP_CON | 0 | 3.6 | ||
6.4 Thermal Information
| THERMAL METRIC(1) | bq24392 | UNIT | |
|---|---|---|---|
| RSE | |||
| 10 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 167.7 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 78.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 95.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 4.7 | °C/W |
| ψJB | Junction-to-board characterization parameter | 95.9 | °C/W |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
6.5 Electrical Characteristics
VBUS = 4.5 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted)(1)
(1) CHG_DET max value will be clamped at 7 V when VVBUS > 7 V
6.6 Typical Characteristics
