8.5 Dissipation Ratings
| PACKAGE(2) | RθJA | RθJC | POWER RATING |
|---|
| TA ≤ 25°C | TA = 85°C |
|---|
| RGT (1) |
39.47°C/W |
2.4°C/W |
2.3 W |
225 mW |
(1) This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. The pad is connected to the ground plane by a 2 × 3 via matrix.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at
www.ti.com.