ZHCSDX9E September 2014 – January 2017 AMC1304L05 , AMC1304L25 , AMC1304M05 , AMC1304M25
PRODUCTION DATA.
- 1 特性
- 2 應用
- 3 說明
- 4 修訂歷史記錄
- 5 Device Comparison Table
- 6 Pin Configurations and Functions
-
7 Specifications
- 7.1 Absolute Maximum Ratings
- 7.2 ESD Ratings
- 7.3 Recommended Operating Conditions
- 7.4 Thermal Information
- 7.5 Power Ratings
- 7.6 Insulation Specifications
- 7.7 Safety-Related Certifications
- 7.8 Safety Limiting Values
- 7.9 Electrical Characteristics: AMC1304x05
- 7.10 Electrical Characteristics: AMC1304x25
- 7.11 Switching Characteristics
- 7.12 Insulation Characteristics Curves
- 7.13 Typical Characteristics
- 8 Detailed Description
- 9 Application and Implementation
- 10Power-Supply Recommendations
- 11Layout
- 12器件和文檔支持
- 13機械、封裝和可訂購信息
11 Layout
11.1 Layout Guidelines
A layout recommendation showing the critical placement of the decoupling capacitors (as close as possible to the AMC1304) and placement of the other components required by the device is shown in Figure 59. For best performance, place the shunt resistor close to the VINP and VINN inputs of the AMC1304 and keep the layout of both connections symmetrical.
For the AMC1304Lx version, place the 100-Ω termination resistor as close as possible to the CLKIN, CLKIN_N inputs of the device to achieve highest signal integrity. If not integrated, an additional termination resistor is required as close as possible to the LVDS data inputs of the MCU or filter device; see Figure 60.
11.2 Layout Examples
Figure 59. Recommended Layout of the AMC1304Mx
Figure 60. Recommended Layout of the AMC1304Lx