ZHCSFZ4 February 2017 AMC1304L05-Q1 , AMC1304L25-Q1 , AMC1304M05-Q1 , AMC1304M25-Q1
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 修訂歷史記錄
- 5 Device Comparison Table
- 6 Pin Configurations and Functions
-
7 Specifications
- 7.1 Absolute Maximum Ratings
- 7.2 ESD Ratings
- 7.3 Recommended Operating Conditions
- 7.4 Thermal Information
- 7.5 Power Ratings
- 7.6 Insulation Specifications
- 7.7 Safety-Related Certifications
- 7.8 Safety Limiting Values
- 7.9 Electrical Characteristics: AMC1304x05-Q1
- 7.10 Electrical Characteristics: AMC1304x25-Q1
- 7.11 Switching Characteristics
- 7.12 Insulation Characteristics Curves
- 7.13 Typical Characteristics
- 8 Detailed Description
- 9 Application and Implementation
- 10Power-Supply Recommendations
- 11Layout
- 12器件和文檔支持
- 13機(jī)械、封裝和可訂購信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DW|16
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DW|16
訂購信息
12 器件和文檔支持
12.1 文檔支持
12.1.1 相關(guān)文檔
相關(guān)文檔請參閱以下部分：
12.2 相關(guān)鏈接
下面的表格列出了快速訪問鏈接。范圍包括技術(shù)文檔、支持與社區(qū)資源、工具和軟件，并且可通過快速訪問立刻訂購。
12.3 接收文檔更新通知
如需接收文檔更新通知，請?jiān)L問 www.cqwzaes.cn 網(wǎng)站上的器件產(chǎn)品文件夾。點(diǎn)擊右上角的提醒我 (Alert me) 注冊后，即可每周定期收到已更改的產(chǎn)品信息。有關(guān)更改的詳細(xì)信息，請查閱已修訂文檔中包含的修訂歷史記錄。
12.4 社區(qū)資源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
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TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
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Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
12.5 商標(biāo)
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.6 靜電放電警告
ESD 可能會損壞該集成電路。德州儀器 (TI) 建議通過適當(dāng)?shù)念A(yù)防措施處理所有集成電路。如果不遵守正確的處理措施和安裝程序 , 可能會損壞集成電路。
ESD 的損壞小至導(dǎo)致微小的性能降級 , 大至整個(gè)器件故障。 精密的集成電路可能更容易受到損壞 , 這是因?yàn)榉浅＜?xì)微的參數(shù)更改都可能會導(dǎo)致器件與其發(fā)布的規(guī)格不相符。
12.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.