ZHCSIL0E april 2008 – august 2023 AM26LV32E
PRODUCTION DATA
| THERMAL METRIC(1) | AM26LV32E | UNIT | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| D (SOIC) | DR (SOIC-Reel) | PW (TSSOP) | PWR (TSSOP-Reel) | NS (SOP) | NSR (SOP-Reel) | RGY (VQFN) | RGY (VQFN) | |||
| 16 PINS | 16 PINS | 16 PINS | 16 PINS | 16 PINS | 16 PINS | 16 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 73.1 | 84.6 | 109 | 107.5 | 69 | 88.5 | 92 | 48.4 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 38.4 | 43.5 | 34 | 38.4 | 34 | 46.2 | 40 | 46.4 | °C/W |
| RθJB |
Junction-to-board thermal resistance |
N/A | 43.2 | N/A | 53.7 | N/A | 50.7 | N/A | 24.6 | °C/W |
|
ΨJT |
Junction-to-top characterization parameter | N/A | 10.4 | N/A | 3.2 | N/A | 13.5 | N/A | 2.3 | °C/W |
| ΨJB | Junction-to-board characterization parameter | N/A | 42.8 | N/A | 53.1 | N/A | 50.3 | N/A | 24.5 | °C/W |
| RθJC(bottom) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | N/A | N/A | N/A | N/A | 8.5 | °C/W |