SBOSA71 July   2021 TMCS1107-Q1

PRODUCTION DATA  

1. 1 Features
2. 2 Applications
3. 3 Description
4. 4 Revision History
5. 5 Device Comparison
6. 6 Pin Configuration and Functions
7. 7 Specifications
   1. 7.1  Absolute Maximum Ratings
   2. 7.2  ESD Ratings
   3. 7.3  Recommended Operating Conditions
   4. 7.4  Thermal Information
   5. 7.5  Power Ratings
   6. 7.6  Insulation Specifications
   7. 7.7  Safety-Related Certifications
   8. 7.8  Safety Limiting Values
   9. 7.9  Electrical Characteristics
   10. 7.10 Typical Characteristics
       1. 7.10.1 Insulation Characteristics Curves
8. 8 Parameter Measurement Information
   1. 8.1 Accuracy Parameters
      1. 8.1.1 Sensitivity Error
      2. 8.1.2 Offset Error and Offset Error Drift
      3. 8.1.3 Nonlinearity Error
      4. 8.1.4 Power Supply Rejection Ratio
      5. 8.1.5 Common-Mode Rejection Ratio
      6. 8.1.6 External Magnetic Field Errors
   2. 8.2 Transient Response Parameters
      1. 8.2.1 Slew Rate
      2. 8.2.2 Propagation Delay and Response Time
      3. 8.2.3 Current Overload Parameters
      4. 8.2.4 CMTI, Common-Mode Transient Immunity
   3. 8.3 Safe Operating Area
      1. 8.3.1 Continuous DC or Sinusoidal AC Current
      2. 8.3.2 Repetitive Pulsed Current SOA
      3. 8.3.3 Single Event Current Capability
9. 9 Detailed Description
   1. 9.1 Overview
   2. 9.2 Functional Block Diagram
   3. 9.3 Feature Description
      1. 9.3.1 Current Input
      2. 9.3.2 Input Isolation
      3. 9.3.3 High-Precision Signal Chain
         1. 9.3.3.1 Lifetime and Environmental Stability
         2. 9.3.3.2 Frequency Response
         3. 9.3.3.3 Transient Response
      4. 9.3.4 Internal Reference Voltage
      5. 9.3.5 Current-Sensing Measurable Ranges
   4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Down Behavior
10. 10Application and Implementation
    1. 10.1 Application Information
       1. 10.1.1 Total Error Calculation Examples
          1. 10.1.1.1 Room Temperature Error Calculations
          2. 10.1.1.2 Full Temperature Range Error Calculations
    2. 10.2 Typical Application
       1. 10.2.1 Design Requirements
       2. 10.2.2 Detailed Design Procedure
       3. 10.2.3 Application Curve
11. 11Power Supply Recommendations
12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
13. 13Device and Documentation Support
    1. 13.1 Device Support
       1. 13.1.1 Development Support
    2. 13.2 Documentation Support
       1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
14. 14Mechanical, Packaging, and Orderable Information