SSZT739 April   2018 TPS82130 , TPSM84209 , TPSM846C24

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   2.     Example of Various Package Types Offered by Texas Instruments
   3.     A More Detailed Look at the inside and outside of the TPSM84209 Power Module
   4.     Smaller Package Size.
   5.     Overmolded Package.
   6.     Improved Thermals.
   7.     Good Emi.
   8.     Excellent Reliability.

Shrink Module Size with Flip Chip on Lead (FCOL) Package Technology