1 Features

• 92.5% System Efficiency at 12 A
• Ultra-Low Power Loss of 1.8 W at 12 A
• Max Rated Continuous Current of 20 A and Peak Current of 45 A
• High-Frequency Operation (up to 2 MHz)
• High-Density SON 3.3-mm × 3.3-mm Footprint
• Ultra-Low Inductance Package
• System Optimized PCB Footprint
• Low Quiescent (LQ) and Ultra-Low Quiescent (ULQ) Current Mode
• 3.3-V and 5-V PWM Signal Compatible
• Diode Emulation Mode with FCCM
• Tri-State PWM Input
• Integrated Bootstrap Diode
• Shoot-Through Protection
• RoHS Compliant – Lead-Free Terminal Plating
• Halogen Free

2 Applications

• NVDC Notebook and Ultrabook PCs
• Tablets
• Point of Load Synchronous Buck in Networking, Telecom, and Computing Systems

3 Description

The CSD95379Q3M NexFET™ power stage is a highly optimized design for use in high-power, high-density synchronous buck converters. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables Connected Standby for Windows® 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces high-current, high-efficiency, and high-speed switching capability in a small 3.3-mm × 3.3-mm outline package. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

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Application Diagram

Typical Power Stage Efficiency and Power Loss