ZHCSP51B december   2020  – may 2023 LMR43610 , LMR43620

PRODUCTION DATA  

1.   1
2. 1 特性
3. 2 應(yīng)用
4. 3 說明
5. 4 Revision History
6. 5 Device Comparison Table
7. 6 Pin Configuration and Functions
8. 7 Specifications
   1. 7.1 Absolute Maximum Ratings
   2. 7.2 ESD Ratings
   3. 7.3 Recommended Operating Conditions
   4. 7.4 Thermal Information
   5. 7.5 Electrical Characteristics
   6. 7.6 System Characteristics
   7. 7.7 Typical Characteristics
9. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagram
   3. 8.3 Feature Description
      1. 8.3.1  Enable, Start-Up, and Shutdown
      2. 8.3.2  External CLK SYNC (with MODE/SYNC)
         1. 8.3.2.1 Pulse-Dependent MODE/SYNC Pin Control
      3. 8.3.3  Adjustable Switching Frequency (with RT)
      4. 8.3.4  Power-Good Output Operation
      5. 8.3.5  Internal LDO, VCC, and VOUT/FB Input
      6. 8.3.6  Bootstrap Voltage and VBOOT-UVLO (BOOT Terminal)
      7. 8.3.7  Output Voltage Selection
      8. 8.3.8  Soft Start and Recovery from Dropout
         1. 8.3.8.1 Recovery from Dropout
      9. 8.3.9  Current Limit and Short Circuit
      10. 8.3.10 Thermal Shutdown
      11. 8.3.11 Input Supply Current
   4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Active Mode
         1. 8.4.3.1 CCM Mode
         2. 8.4.3.2 Auto Mode – Light-Load Operation
            1. 8.4.3.2.1 Diode Emulation
            2. 8.4.3.2.2 Frequency Reduction
         3. 8.4.3.3 FPWM Mode – Light-Load Operation
         4. 8.4.3.4 Minimum On-Time (High Input Voltage) Operation
         5. 8.4.3.5 Dropout
10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
       1. 9.2.1 Design Requirements
       2. 9.2.2 Detailed Design Procedure
          1. 9.2.2.1 Choosing the Switching Frequency
          2. 9.2.2.2 Setting the Output Voltage
             1. 9.2.2.2.1 FB for Adjustable Output
          3. 9.2.2.3 Inductor Selection
          4. 9.2.2.4 Output Capacitor Selection
          5. 9.2.2.5 Input Capacitor Selection
          6. 9.2.2.6 CBOOT
          7. 9.2.2.7 VCC
          8. 9.2.2.8 CFF Selection
             1. 9.2.2.8.1 External UVLO
          9. 9.2.2.9 Maximum Ambient Temperature
       3. 9.2.3 Application Curves
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
       1. 9.5.1 Layout Guidelines
          1. 9.5.1.1 Ground and Thermal Considerations
       2. 9.5.2 Layout Example
11. 10Device and Documentation Support
    1. 10.1 Device Support
       1. 10.1.1 第三方產(chǎn)品免責(zé)聲明
       2. 10.1.2 Device Nomenclature
    2. 10.2 Documentation Support
       1. 10.2.1 Related Documentation
    3. 10.3 支持資源
    4. 10.4 Trademarks
    5. 10.5 靜電放電警告
    6. 10.6 術(shù)語表
12. 11Mechanical, Packaging, and Orderable Information

LMR436x0 在 150°C T_JMAX 下 I_Q < 2.5μA 并采用 4mm² HotRod^? QFN 封裝的 36V 1A/2A 降壓轉(zhuǎn)換器