1.1 Features

• TI's Single-Chip Bluetooth Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support; Available in Two Variants:
  • Dual-Mode Bluetooth CC2564 Controller
  • Bluetooth CC2560 Controller
• CC2564 Bluetooth 4.1 Controller Subsystem Qualified (QDID 58852); Compliant up to the HCI Layer
• Highly Optimized for Low-Cost Designs:
  • Single-Ended 50-Ω RF Interface
  • Package Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm x 8-mm mrQFN
• BR/EDR Features Include:
  • Up to 7 Active Devices
  • Scatternet: Up to 3 Piconets Simultaneously, 1 as Master and 2 as Slaves
  • Up to 2 SCO Links on the Same Piconet
  • Support for All Voice Air-Coding – Continuously Variable Slope Delta (CVSD), A-Law, μ-Law, and Transparent (Uncoded)
  • CC2560B/CC2564B Devices Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
  • Support of Multiple Bluetooth Profiles With Enhanced QoS
• LE Features Include:
  • Support of Up to 10 (CC2564B) Connections
  • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
  • Independent Buffering for LE Allows Large Numbers of Multiple Connections Without Affecting BR/EDR Performance.
  • Built-In Coexistence and Prioritization Handling for BR/EDR and LE
• Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
  • Class 1 TX Power Up to +10 dBm
  • –95 dbm Typical RX Sensitivity
  • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
  • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
  • Provides Longer Range, Including 2x Range Over Other LE-Only Solutions
• Advanced Power Management for Extended Battery Life and Ease of Design
  • On-Chip Power Management, Including Direct Connection to Battery
  • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
  • Shutdown and Sleep Modes to Minimize Power Consumption
• Physical Interfaces:
  • UART Interface With Support for Maximum Bluetooth Data Rates
    • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
    • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps (CC2560B and CC2564B Only)
  • Fully Programmable Digital PCM-I2S Codec Interface
• Flexibility for Easy Stack Integration and Validation Into Various Microcontrollers, Such as MSP430™ and ARM® Cortex®-M3 and Cortex®-M4 MCUs
• CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack
• Device Pin-to-Pin Compatible With Previous Devices or Modules

1.2 Applications

• Mobile Accessories
• Sports and Fitness Applications
• Wireless Audio Solutions
• Remote Controls
• Toys
• Test and Measurement
• Industrial: Cable Replacement
• Wireless Sensors
• Automotive Aftermarket
• Point of Service (POS)
• Wellness and Health

1.3 Description

The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to other Bluetooth LE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.

The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TI's MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI's third party. iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Some of the profiles supported include the following:

• Serial port profile (SPP)
• Advanced audio distribution profile (A2DP)
• Audio/video remote control profile (AVRCP)
• Handsfree profile (HFP)
• Human interface device (HID)
• Generic attribute profile (GATT)
• Several Bluetooth LE profiles and services

In addition to software, this solution consists of multiple reference designs with a low BOM cost, including a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions.

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1.4 Functional Block Diagram

Note: The following technologies and assisted modes cannot be used simultaneously with the coprocessor: Bluetooth LE, ANT, assisted HFP 1.6 (WBS), and assisted A2DP. One and only one technology or assisted mode can be used at a time.

Figure 1-1 Functional Block Diagram