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SLUSAG0A March 2011 – March 2016 UC1707-SP

PRODUCTION DATA.

封裝選項

機械數據 (封裝 | 引腳)

W|16
- MCFP004C
J|16
- MGDI003
FK|20
- MCQC028

散熱焊盤機械數據 (封裝 | 引腳)

訂購信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

			MIN	MAX	UNIT
V_IN	Supply voltage			40	V
V_C	Collector supply voltage			40	V
	Digital inputs⁽²⁾			5.5	V
	Output current (each output, source or sink) steady-state			±500	mA
	Peak transient			±1	A
	Capacitive discharge energy			15	mJ
	Analog stop inputs			V_IN
T_J	Operating virtual-junction temperature			150	°C
	Power dissipation at T_case = 25°C⁽²⁾	J package		13	W
		W package		15	W
		FK package		13	W
	Lead temperature (soldering, 10 s)			300	°C
	Operating temperature		–55	125	°C
T_stg	Storage temperature		–65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltages are with respect to the four ground pins which must be connected together. All currents are positive into, negative out of the specified terminal. Digital drive can exceed 5.5 V if input current is limited to 10 mA. Consult packaging section of datasheet for thermal limitations and considerations of package.

6.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±2000	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

		MIN	NOM	MAX	UNIT
V_IN	Supply voltage	5	12	38	V
V_C	Supply voltage	5	12	38	V

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		UC1707-SP			UNIT
		J (CDIP)	FK (LCCC)	W (CFP)
		16 PINS	20 PINS	16 PINS
R_θJC(top)	Junction-to-case (top) thermal resistance	36	31.8	53.6	°C/W
R_θJB	Junction-to-board thermal resistance	55.2	31.3	105	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	9.5	2.8	4.2	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Unless otherwise stated, these specifications apply for T_A = –55°C to 125°C; V_IN = V_C = 20 V. T_A = T_J.

PARAMETER		TEST CONDITIONS		MIN	TYP	MAX	UNIT
V_IN	Supply current	V_IN = 40 V			12	15	mA
V_C	Supply current	V_C = 40 V, outputs low			5.2	7.5	mA
V_C	Leakage current	V_IN = 0, V_C - 30 V, no load			0.05	0.1	mA
	Digital input low level					0.8	V
	Digital input high level			2.2			V
	Input current	V_I = 0			–0.06	–1.0	mA
	Input leakage	V_I = 5 V			0.05	0.1	mA
V_C – V_O	Output high sat	I_O = –50 mA				2.0	V
V_C – V_O	Output high sat	I_O = –500 mA				2.5	V
V_O	Output low sat	I_O = –50 mA				0.4	V
V_O	Output low sat	I_O = –500 mA				2.5	V
	Analog threshold	V_CM = 0 to 15 V	8761901	100	130	150	mV
	Analog threshold	V_CM = 0 to 15 V	8761903	90	130	150	mV
	Input bias current	V_CM = 0			–10	–20	μA
	Thermal shutdown				155		°C
	Shutdown threshold	Pin 7 input		0.4	1.0	2.2	V
	Latch disable threshold	Pin 3 input		0.8	1.2	2.2	V

6.6 Typical Switching Characteristics

V_IN = V_C = 20 V, T_A = 25°C. Delays measured to 10% output change.

PARAMETER		TEST CONDITIONS	OUTPUT CL =			UNIT
FROM INV. INPUT TO OUTPUT			open	1.0	2.2	nF
	Rise time delay		40	50	60	ns
	10% to 90% rise		25	40	50	ns
	Fall time delay		30	40	50	ns
	90% to 10% fall		25	40	50	ns
FROM N.I. INPUT TO OUTPUT
	Rise time delay		30	40	50	ns
	10% to 90% rise		25	40	50	ns
	Fall time delay		45	55	65	ns
	90% to 10% fall		25	40	50	ns
V_C	Cross-conduction current spike duration	Output rise	25			ns
		Output fall	0			ns
	Analog shutdown delay	Stop non-Inv. = 0 V	180			ns
		Stop Inv. = 0 to 0.5 V	180			ns
	Digital shutdown delay	2 V input on Pin 7	50			ns