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SLVSAI0J October 2010 – May 2016 TPS82670 , TPS82671 , TPS826711 , TPS826716 , TPS82672 , TPS826721 , TPS82673 , TPS82674 , TPS826745 , TPS82675 , TPS82676 , TPS826765 , TPS82677

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.

封裝選項

機械數據 (封裝 | 引腳)

SIP|8
- MUSS001E

散熱焊盤機械數據 (封裝 | 引腳)

訂購信息

12 Layout

12.1 Layout Guidelines

In making the pad size for the µSiP LGA balls, it is recommended that the layout use non-solder-mask defined (NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the opening size is defined by the copper pad width. Figure 43 shows the appropriate diameters for a MicroSiP^TM layout.

12.2 Layout Example

TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195 land_pad_lvsai0.gif

Figure 43. Recommended Land Pattern Image And Dimensions

SOLDER PAD DEFINITIONS⁽¹⁾⁽²⁾⁽³⁾⁽⁴⁾	COPPER PAD	SOLDER MASK ⁽⁵⁾ OPENING	COPPER THICKNESS	STENCIL ⁽⁶⁾ OPENING	STENCIL THICKNESS
Non-solder-mask defined (NSMD)	0.30mm	0.360mm	1oz max (0.032mm)	0.34mm diameter	0.1mm thick

(1) Circuit traces from non-solder-mask defined PWB lands should be 75 μm to 100 μm wide in the exposed area inside the solder mask opening. Wider trace widths reduce device stand off and affect reliability.

(2) Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the intended application.

(3) Recommend solder paste is Type 3 or Type 4.

(4) For a PWB using a Ni/Au surface finish, the gold thickness should be less than 0.5 µm to avoid a reduction in thermal fatigue performance.

(5) Solder mask thickness should be less than 20 μm on top of the copper circuit pattern.

(6) For best solder stencil performance use laser cut stencils with electro polishing. Chemically etched stencils give inferior solder paste volume control.

12.3 Surface Mount Information

The TPS8267x MicroSiP™ DC/DC converter uses an open frame construction that is designed for a fully automated assembly process and that features a large surface area for pick and place operations. See the "Pick Area" in the package drawings.

Package height and weight have been kept to a minimum thereby to allow the MicroSiP™ device to be handled similarly to a 0805 component.

See JEDEC/IPC standard J-STD-20b for reflow recommendations.