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SLVS520C March 2006 – October 2015 TPS63000 , TPS63001 , TPS63002

PRODUCTION DATA.

封裝選項

機械數(shù)據(jù) (封裝 | 引腳)

DRC|10
- MPDS117L

散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)

DRC|10
- QFND013N

訂購信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

	MIN	MAX	UNIT
Input voltage on VIN, VINA, L1, L2, VOUT, PS/SYNC, EN, FB	–0.3	7	V
Operating virtual junction temperature, T_J	–40	150	°C
Storage temperature, T_stg	–65	150	°C

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.

6.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾	2000	V
V_(ESD)	Electrostatic discharge	Charged device model (CDM), per JEDEC specification JESD22-C101, all pins⁽²⁾	1000	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

	MIN	MAX	UNIT
Supply voltage at VIN, VINA	1.8	5.5	V
Operating free air temperature, T_A	–40	85	°C
Operating virtual junction temperature, T_J	–40	125	°C

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		TPS6300x	UNIT
		DRC (VSON)
		10 PINS
R_θJA	Junction-to-ambient thermal resistance	46.8	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	62.5	°C/W
R_θJB	Junction-to-board thermal resistance	21.4	°C/W
ψ_JT	Junction-to-top characterization parameter	1.4	°C/W
ψ_JB	Junction-to-board characterization parameter	21.5	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	4.1	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

over recommended free-air temperature range and over recommended input voltage range (typical at an ambient temperature range of 25°C) (unless otherwise noted)

PARAMETER			TEST CONDITIONS	MIN	TYP	MAX	UNIT
DC-DC STAGE
V_IN	Input voltage range			1.8		5.5	V
V_IN	Input voltage range for start-up			1.9		5.5	V
V_OUT	TPS63000 output voltage range			1.2		5.5	V
V_FB	TPS63000 feedback voltage		PS/SYNC = V_IN	495	500	505	mV
f	Oscillator frequency			1250		1500	kHz
	Frequency range for synchronization			1250		1800	kHz
I_SW	Switch current limit		V_IN = V_INA = 3.6 V, T_A = 25°C	1600	1800	2000	mA
	High-side switch ON-resistance		V_IN = V_INA = 3.6 V		100		mΩ
	Low-side switch ON-resistance		V_IN = V_INA = 3.6 V		100		mΩ
	Line regulation					0.5%
	Load regulation					0.5%
I_q	Quiescent current	VIN	I_OUT= 0 mA, V_EN= V_IN = V_INA = 3.6 V, V_OUT = 3.3 V		1	1.5	μA
		VINA			40	50	μA
		VOUT (adjustable output voltage)			4	6	μA
	FB input impedance (fixed output voltage)				1		MΩ
I_S	Shutdown current		V_EN = 0 V, V_IN = V_INA = 3.6 V		0.1	1	μA
CONTROL STAGE
V_UVLO	Undervoltage lockout threshold		V_INA voltage decreasing	1.5	1.7	1.8	V
V_IL	EN, PS/SYNC input low voltage					0.4	V
V_IH	EN, PS/SYNC input high voltage			1.2			V
	EN, PS/SYNC input current		Clamped on GND or VINA		0.01	0.1	μA
	Overtemperature protection				140		°C
	Overtemperature hysteresis				20		°C

6.6 Typical Characteristics

TPS63000 TPS63001 TPS63002 io_vi_lvs520.gif

Figure 1. Maximum Output Current vs Input Voltage