6.1 Absolute Maximum Ratings(1)
| MIN | MAX | UNIT |
|---|
| Input voltage |
VIN |
–0.3 |
20 |
V |
| PVIN |
–0.3 |
20 |
| EN |
–0.3 |
6 |
| BOOT |
–0.3 |
27 |
| VSENSE |
–0.3 |
3 |
| COMP |
–0.3 |
3 |
| PWRGD |
–0.3 |
6 |
| SS/TR |
–0.3 |
3 |
| RT/CLK |
–0.3 |
6 |
| Output voltage |
BOOT-PH |
0 |
7.5 |
V |
| PH |
–1 |
20 |
| PH 10-ns transient |
–3 |
20 |
| PH 5-ns transient |
–4 |
20 |
| Vdiff (GND to exposed thermal pad) |
–0.2 |
0.2 |
V |
| Source current |
RT/CLK |
| ±100 |
µA |
| PH |
| Current Limit |
A |
| Sink current |
PH |
| Current Limit |
A |
| PVIN |
| Current Limit |
A |
| COMP |
| ±200 |
µA |
| PWRGD |
–0.1 |
5 |
mA |
| Operating junction temperature |
–40 |
150 |
°C |
| Storage temperature, Tstg |
–65 |
150 |
°C |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.