ZHCSO95B june 2022 – may 2023 TPS1641
PRODUCTION DATA
During power or current limiting, there is a power dissipation [(VIN – VOUT) × IOUT] in the internal FET of the device. Due to this power dissipation, the temperature (TJ) of device increases. When the device temperature increases above TTSD, it shuts down. After the thermal shutdown, the TPS16411, TPS16413, TPS16415, and TPS16417 remain latched. To reset the latch, toggle EN/SHDN or recycle the Vcc supply. To reset the latch, keep EN/SHDN pin low for duration more than tLow_SHDN.
After thermal shutdown, the TPS16410, TPS16412, TPS16414, and TPS16416 devices wait for temperature to go below [TTSD – TTSD-hyst] and then the device restarts after a delay of tretry.