ZHCSLR4F december 2019 – july 2023 TMUX1308-Q1 , TMUX1309-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | TMUX1309-Q1 | UNIT | |||
|---|---|---|---|---|---|
| PW (TSSOP) | DYY (SOT) | BQB (WQFN) | |||
| PINS | PINS | PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 139.6 | 172.4 | 94.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 77.2 | 107.0 | 92.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 84.2 | 96.1 | 64.5 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 26.5 | 19.7 | 13.3 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 83.8 | 95.9 | 64.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | 42.7 | °C/W |