ZHCSMO9A December 2020 – March 2023 TLV766-Q1
PRODUCTION DATA
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DRB|8
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DRB|8
訂購信息
8.2.3 Application Curves
| VIN = 5 V, VOUT = 3.3 V, COUT = 1 μF, CFF = 10 pF |
| VIN = 5 V, VOUT = 3.3 V, COUT = 1 μF, CFF = 0 pF |