ZHCSGF1A July 2017 – September 2018 TLV741P
PRODUCTION DATA.
| THERMAL METRIC(1) | TLV741P | UNIT | ||
|---|---|---|---|---|
| DQN (X2SON) | DBV (SOT-23) | |||
| 4 PINS | 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 228.5 | 249 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 210.4 | 172.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 174.7 | 76.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 21.2 | 49.7 | °C/W |
| ψJB | Junction-to-board characterization parameter | 174.5 | 75.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 140.6 | N/A | °C/W |