ZHCSK00D September 2010 – July 2019 TLV702
PRODUCTION DATA.
| THERMAL METRIC(1) | TLV702 | UNIT | ||
|---|---|---|---|---|
| DBV (SOT-23) | DSE (WSON) | |||
| 5 PINS | 6 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 249.2 | 321.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 136.4 | 207.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 85.9 | 281.5 | °C/W |
| ψJT | Junction-to-top characterization parameter | 19.5 | 42.4 | °C/W |
| ψJB | Junction-to-board characterization parameter | 85.3 | 284.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | 142.3 | °C/W |