SBOS458H December 2008 – June 2015 THS4521 , THS4522 , THS4524
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
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7 Specifications
- 7.1 Absolute Maximum Ratings
- 7.2 ESD Ratings
- 7.3 Recommended Operating Conditions
- 7.4 Thermal Information
- 7.5 Electrical Characteristics: VS+ - VS- = 3.3 V
- 7.6 Electrical Characteristics: VS+ - VS- = 5 V
- 7.7 Typical Characteristics
- 7.8 Typical Characteristics: VS+ - VS- = 3.3 V
- 7.9 Typical Characteristics: 5 V
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8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3
Feature Description
- 8.3.1 Frequency Response
- 8.3.2 Distortion
- 8.3.3 Slew Rate, Transient Response, Settling Time, Output Impedance, Overdrive, Output Voltage, and Turn-On/Turn-Off Time
- 8.3.4 Common-Mode and Power-Supply Rejection
- 8.3.5 VOCM Input
- 8.3.6 Typical Performance Variation With Supply VoltageTypical Performance Variation with Supply Voltage section
- 8.3.7 title of Single-Supply Operation sectionSingle-Supply Operation
- 8.3.8 Low-Power Applications and the Effects of Resistor Values on Bandwidth
- 8.3.9 Frequency Response Variation due to Package Options
- 8.3.10 Driving Capacitive Loads
- 8.3.11 Audio Performance
- 8.3.12 Audio On/Off Pop Performance
- 8.4
Device Functional Modes
- 8.4.1
Operation from Single-Ended Sources to Differential Outputs
- 8.4.1.1 AC-Coupled Signal Path Considerations for Single-Ended Input to Differential Output Conversion
- 8.4.1.2 DC-Coupled Input Signal Path Considerations for Single-Ended to Differential Conversion
- 8.4.1.3 Resistor Design Equations for the Single-Ended to Differential Configuration of the FDA
- 8.4.1.4 Input Impedance for the Single-Ended to Differential FDA Configuration
- 8.4.2 Differential-Input to Differential-Output Operation
- 8.4.1
Operation from Single-Ended Sources to Differential Outputs
- 8.5 Programming
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9 Application and Implementation
- 9.1 Application Information
- 9.2 Typical Applications
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
12 Device and Documentation Support
12.1 Device Support
12.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
12.2 Related Links
Table 13 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.
Table 13. Related Links
| PARTS | PRODUCT FOLDER | SAMPLE & BUY | TECHNICAL DOCUMENTS | TOOLS & SOFTWARE | SUPPORT & COMMUNITY |
|---|---|---|---|---|---|
| THS4521 | Click here | Click here | Click here | Click here | Click here |
| THS4522 | Click here | Click here | Click here | Click here | Click here |
| THS4524 | Click here | Click here | Click here | Click here | Click here |
12.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
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TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
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Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
12.4 Trademarks
E2E is a trademark of Texas Instruments.
I2S is a trademark of NXP Semiconductor.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.