ZHCSFI5 September   2016 REF6225 , REF6230 , REF6233 , REF6241 , REF6245 , REF6250

PRODUCTION DATA.  

1. 1 特性
2. 2 應(yīng)用
3. 3 說(shuō)明
4. 4 Device Comparison Table
5. 5 Pin Configuration and Functions
6. 6 Specifications
   1. 6.1 Absolute Maximum Ratings
   2. 6.2 ESD Ratings
   3. 6.3 Recommended Operating Conditions
   4. 6.4 Thermal Information
   5. 6.5 Electrical Characteristics
   6. 6.6 Typical Characteristics
7. 7 Parameter Measurement Information
   1. 7.1 Solder Heat Shift
   2. 7.2 Thermal Hysteresis
   3. 7.3 Reference Droop Measurements
   4. 7.4 1/f Noise Performance
8. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagram
   3. 8.3 Feature Description
      1. 8.3.1 Integrated ADC Drive Buffer
      2. 8.3.2 Temperature Drift
      3. 8.3.3 Load Current
      4. 8.3.4 Stability
   4. 8.4 Device Functional Modes
9. 9 Applications and Implementation
   1. 9.1 Application Information
   2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
         1. 9.2.2.1 Results
      3. 9.2.3 Application Curves
10. 10Power Supply Recommendations
11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
12. 12器件和文檔支持
    1. 12.1 文檔支持
       1. 12.1.1 相關(guān)文檔　
    2. 12.2 相關(guān)鏈接
    3. 12.3 接收文檔更新通知
    4. 12.4 社區(qū)資源
    5. 12.5 商標(biāo)
    6. 12.6 靜電放電警告
    7. 12.7 Glossary
13. 13機(jī)械、封裝和可訂購(gòu)信息