ZHCSD61L July 2012 – May 2019 LP8556
PRODUCTION DATA.
| THERMAL METRIC(1) | LP8556 | UNIT | ||
|---|---|---|---|---|
| YFQ (DSBGA) | RTW (WQFN) | |||
| 20 PINS | 24 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 66.2 | 35.0 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 0.5 | 32.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 15.1 | 13.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.9 | 0.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 15.0 | 13.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | 3.3 | °C/W |