5 Pin Configuration and Functions

Figure 5-1 RHF Package, 28-Pin VQFN, (Top View)

Table 5-1 Pin Functions

PIN		TYPE⁽²⁾	DESCRIPTION
NAME	NO.	TYPE⁽²⁾	DESCRIPTION
EN	9	I	Device enable pin. EN = logic low = normal operation (default); EN = logic high = low power mode.^⁽¹⁾
GND	11, 26	I	Amplifier ground.
IDC_EN	28	I	Ambient light cancellation loop enable. IDC_EN = logic low = enable DC cancellation (default); IDC_EN = logic high = disable DC cancellation.^⁽¹⁾
IN1	1	I	Transimpedance amplifier input – Channel 1.
IN2	3	I	Transimpedance amplifier input – Channel 2.
IN3	6	I	Transimpedance amplifier input – Channel 3.
IN4	8	I	Transimpedance amplifier input – Channel 4.
M1	25	I	Select Channel 1. M1 = logic high = Channel 1 operational and output switches closed. M1 = logic low (default) = Channel 1 in standby power mode and output switches open. ^⁽¹⁾
M2	24	I	Select Channel 2. M2 = logic high = Channel 2 operational and output switches closed. M2 = logic low (default) = Channel 2 in standby power mode and output switches open. ^⁽¹⁾
M3	13	I	Select Channel 3. M3 = logic high = Channel 3 operational and output switches closed. M3 = logic low (default) = Channel 3 in standby power mode and output switches open. ^⁽¹⁾
M4	12	I	Select Channel 4. M4 = logic high = Channel 4 operational and output switches closed. M4 = logic low (default) = Channel 4 in standby power mode and output switches open. ^⁽¹⁾
OUT1–	22	O	Channel 1 inverting amplifier output. When light is incident on the photodiode the output pin transitions in a negative direction from the no light condition.
OUT1+	21	O	Channel 1 noninverting amplifier output. When light is incident on the photodiode the output pin transitions in a positive direction from the no light condition.
OUT2–	20	O	Channel 2 inverting amplifier output. When light is incident on the photodiode the output pin transitions in a negative direction from the no light condition.
OUT2+	19	O	Channel 2 noninverting amplifier output. When light is incident on the photodiode the output pin transitions in a positive direction from the no light condition.
OUT3–	18	O	Channel 3 inverting amplifier output. When light is incident on the photodiode the output pin transitions in a negative direction from the no light condition.
OUT3+	17	O	Channel 3 noninverting amplifier output. When light is incident on the photodiode the output pin transitions in a positive direction from the no light condition.
OUT4–	16	O	Channel 4 inverting amplifier output. When light is incident on the photodiode the output pin transitions in a negative direction from the no light condition.
OUT4+	15	O	Channel 4 noninverting amplifier output. When light is incident on the photodiode the output pin transitions in a positive direction from the no light condition.
VDD1	2, 4, 5, 7	I	Positive power supply for the transimpedance amplifier stage. Each pin should be tied to the same power supply with independent power-supply bypassing.
VDD2	14, 23	I	Positive power supply for the differential amplifier stage. Tie VDD1 and VDD2 to the same power supply with independent power-supply bypassing.
VOCM	27	I	Differential amplifier common-mode output control.
VOD	10	I	Differential amplifier differential output offset control.
Thermal pad		—	Connect the thermal pad to the same potential as pin 11 and 26 (GND).

(1) TI recommends driving a digital pin with a low-impedance source rather than leaving the pin floating because fast-moving transients can couple into the pin and inadvertently change the logic level.

(2) I = input, O = output

DIE THICKNESS	BACKSIDE FINISH	BACKSIDE POTENTIAL	BOND PAD METALLIZATION
381 μm	Silicon with backgrind	Wafer backside is not electrically isolated and should be held at the same potential as the most negative power supply connected to the die (GND)	AlCu

Figure 5-2 Bare Die Package

Table 5-2 Bond Pad Coordinates of Bare Die Version in Microns

PAD NUMBER	PAD NAME	X-MIN	Y-MIN	X-MAX	Y-MAX
1	IN1	15	1981.075	90	2056.075
2	VDD1	15	1795.225	90	1870.225
3	GND	15	1663.3	90	1738.3
4	IN2	15	1450.675	90	1525.675
5	VDD1	15	1295.225	90	1370.225
6	GND	15	1163.3	90	1238.3
7	VDD1	15	1026.65	90	1101.65
8	IN3	15	898.55	90	973.55
9	GND	15	766.475	90	841.475
10	GND	15	590.775	90	665.775
11	VDD1	15	435.325	90	510.325
12	IN4	15	301.75	90	376.75
13	EN	172.675	15	247.675	90
14	VOD	329.35	15	404.35	90
15	GND	522.85	15	672.85	90
16	M4	718.525	15	793.525	90
17	M3	857.95	15	932.95	90
18	VDD2	1001.725	15	1151.725	90
19	OUT4+	1176	244.2	1251	319.2
20	OUT4–	1176	552.2	1251	627.2
21	OUT3+	1176	744.2	1251	819.2
22	GND	1176	864.45	1251	1014.45
23	OUT3–	1176	1052.2	1251	1127.2
24	OUT2+	1176	1244.2	1251	1319.2
25	GND	1176	1364.45	1251	1514.45
26	OUT2–	1176	1552.2	1251	1627.2
27	OUT1+	1176	1744.2	1251	1819.2
28	OUT1–	1176	2052.2	1251	2127.2
29	VDD2	1001.725	2285	1151.725	2360
30	M2	857.95	2285	932.95	2360
31	M1	718.525	2285	793.525	2360
32	GND	497.85	2285	672.85	2360
33	VOCM	329.35	2285	404.35	2360
34	IDC_EN	172.675	2285	247.675	2360