ZHCSF77A July   2016  – July 2016 LMH2832

PRODUCTION DATA.  

1. 1 特性
2. 2 應用
3. 3 說明
4. 4 修訂歷史記錄
5. 5 Device Comparison Table
6. 6 Pin Configuration and Functions
7. 7 Specifications
   1. 7.1 Absolute Maximum Ratings
   2. 7.2 ESD Ratings
   3. 7.3 Recommended Operating Conditions
   4. 7.4 Thermal Information
   5. 7.5 Electrical Characteristics
   6. 7.6 Timing Requirements: SPI
   7. 7.7 Typical Characteristics
8. 8 Parameter Measurement Information
   1. 8.1 Setup Diagrams
   2. 8.2 ATE Testing and DC Measurements
   3. 8.3 Frequency Response
   4. 8.4 Distortion
   5. 8.5 Noise Figure
   6. 8.6 Pulse Response, Slew Rate, and Overdrive Recovery
   7. 8.7 Power-Down
   8. 8.8 Crosstalk, Gain Matching, and Phase Matching
   9. 8.9 Output Measurement Reference Points
9. 9 Detailed Description
   1. 9.1 Overview
   2. 9.2 Functional Block Diagram
   3. 9.3 Feature Description
      1. 9.3.1 Analog Input Characteristics
      2. 9.3.2 Analog Output Characteristics
      3. 9.3.3 Driving Low Insertion-Loss Filters
      4. 9.3.4 Input Impedance Matching
      5. 9.3.5 Power-On Reset (POR)
   4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Down (PD)
      2. 9.4.2 Gain Control
   5. 9.5 Programming
      1. 9.5.1 Details of the Serial Interface
      2. 9.5.2 Timing Diagrams
   6. 9.6 Register Maps
      1. 9.6.1 Register Descriptions
         1. 9.6.1.1 SW Reset Register (address = 2)
      2. 9.6.2 Power-Down Control Register (address = 3)
      3. 9.6.3 Channel A RW0 Register (address = 4)
      4. 9.6.4 Channel A RW1 Register (address = 5)
      5. 9.6.5 Channel B RW0 Register (address = 6)
      6. 9.6.6 Channel B RW1 Register (address = 7)
10. 10Application and Implementation
    1. 10.1 Application Information
       1. 10.1.1 Driving ADCs
          1. 10.1.1.1 SNR Considerations
          2. 10.1.1.2 SFDR Considerations
          3. 10.1.1.3 ADC Input Common-Mode Voltage Considerations (AC-Coupled Input)
          4. 10.1.1.4 ADC Input Common-Mode Voltage Considerations (DC-Coupled Input)
    2. 10.2 Typical Applications
       1. 10.2.1 DOCSIS 3.X Driver
          1. 10.2.1.1 Design Requirements
          2. 10.2.1.2 Detailed Design Procedure
             1. 10.2.1.2.1 Source Resistance Matching
             2. 10.2.1.2.2 Output Impedance Matching
             3. 10.2.1.2.3 Voltage Headroom Considerations
          3. 10.2.1.3 Application Curve
       2. 10.2.2 IQ Receiver
    3. 10.3 Do's and Don'ts
       1. 10.3.1 Do:
       2. 10.3.2 Don't:
11. 11Power Supply Recommendations
    1. 11.1 Split Supplies
    2. 11.2 Supply Decoupling
12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
13. 13器件和文檔支持
    1. 13.1 器件支持
       1. 13.1.1 器件命名規(guī)則
    2. 13.2 文檔支持
       1. 13.2.1 相關文檔　
    3. 13.3 接收文檔更新通知
    4. 13.4 社區(qū)資源
    5. 13.5 商標
    6. 13.6 靜電放電警告
    7. 13.7 Glossary
14. 14機械、封裝和可訂購信息