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SNVS119D March 1998 – May 2016 LM2597 , LM2597HV

PRODUCTION DATA.

封裝選項

機械數據 (封裝 | 引腳)

D|8
- MSOI002K
P|8
- MPDI001B

散熱焊盤機械數據 (封裝 | 引腳)

訂購信息

7 Specifications

7.1 Absolute Maximum Ratings ⁽¹⁾⁽²⁾

			MIN	MAX	UNIT
Maximum supply voltage, V_IN⁽³⁾		LM2597		45	V
Maximum supply voltage, V_IN⁽³⁾		LM2597HV		60	V
SD/SS pin input voltage⁽⁴⁾				6	V
Delay pin voltage⁽⁴⁾				1.5	V
Flag pin voltage			–0.3	45	V
Bias supply voltage, V_BS			–0.3	30	V
Feedback pin voltage			–0.3	25	V
Output voltage to ground (steady-state)			–1	1	V
Power dissipation			Internally limited
Lead temperature	D package	Vapor phase (60 sec)		215	°C
	D package	Infrared (15 sec)		220
	P package (soldering, 10 sec)			260
Maximum junction temperature				150	°C
Storage temperature, T_stg			–65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.

(3) V_IN = 40V for the LM2597 and 60V for the LM2597HV.

(4) Voltage internally clamped. If clamp voltage is exceeded, limit current to a maximum of 1 mA.

7.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾⁽²⁾	±2000	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) The human body model is a 100 pF capacitor discharged through a 1.5k resistor into each pin.

7.3 Recommended Operating Conditions

		MIN	MAX	UNIT
Supply voltage	LM2597	4.5	40	V
Supply voltage	LM2597HV	4.5	60	V
Temperature		–40	125	°C

7.4 Thermal Information

THERMAL METRIC⁽¹⁾		LM2597, LM2597HV		UNIT
		D (SOIC)	P (PDIP)
		8 PINS	8 PINS
R_θJA	Junction-to-ambient thermal resistance⁽²⁾	95	150	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

(2) Junction-to-ambient thermal resistance with approximately 1 square inch of printed circuit board copper surrounding the leads. Additional copper area will lower thermal resistance further.

7.5 Electrical Characteristics – 3.3 V

Specifications are for T_J = 25°C, V_INmax = 40 V for the LM2597, and 60 V for the LM2597HV (unless otherwise noted).

PARAMETER		TEST CONDITIONS		MIN⁽¹⁾	TYP ⁽²⁾	MAX⁽¹⁾	UNIT
SYSTEM PARAMETERS⁽³⁾⁽⁴⁾ (See Figure 46 for test circuit)
V_OUT	Output voltage	4.75 V ≤ V_IN ≤ V_INmax, 0.1 A ≤ I_LOAD ≤ 0.5 A	T_J = 25°C	3.168	3.3	3.432	V
V_OUT	Output voltage	4.75 V ≤ V_IN ≤ V_INmax, 0.1 A ≤ I_LOAD ≤ 0.5 A	Over full operating temperature range	3.135		3.465	V
η	Efficiency	V_IN = 12 V, I_LOAD = 0.5 A			80%

(1) All room temperature limits are 100% production tested. All limits at temperature extremes are specified via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).

(2) Typical numbers are at 25°C and represent the most likely norm.

(3) External components such as the catch diode, inductor, input and output capacitors can affect switching regulator system performance. When the LM2597xx is used as shown in the Figure 46 test circuit, system performance is shown in the test conditions column.