ZHCSCP3B JULY   2014  – September 2015 HDC1000

PRODUCTION DATA.  

1. 1 特性
2. 2 應(yīng)用
3. 3 說明
4. 4 典型應(yīng)用
5. 5 修訂歷史記錄
6. 6 Pin Configuration and Functions
7. 7 Specifications
   1. 7.1 Absolute Maximum Ratings
   2. 7.2 ESD Ratings
   3. 7.3 Recommended Operating Conditions
   4. 7.4 Thermal Information
   5. 7.5 Electrical Characteristics
   6. 7.6 I2C Interface Electrical Characteristics
   7. 7.7 I2C Interface Timing Requirements
   8. 7.8 Typical Characteristics
8. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagram
   3. 8.3 Feature Description
      1. 8.3.1 Power Consumption
      2. 8.3.2 Voltage Supply Monitoring
      3. 8.3.3 Heater
   4. 8.4 Device Functional Modes
   5. 8.5 Programming
      1. 8.5.1 I2C Serial Bus Address Configuration
      2. 8.5.2 I2C Interface
         1. 8.5.2.1 Serial Bus Address
         2. 8.5.2.2 Read and Write Operations
         3. 8.5.2.3 Device Measurement Configuration
   6. 8.6 Register Map
      1. 8.6.1 Temperature Register
      2. 8.6.2 Humidity Register
      3. 8.6.3 Configuration Register
      4. 8.6.4 Serial Number Registers
      5. 8.6.5 Manufacturer ID Register
      6. 8.6.6 Device Register ID
9. 9 Application and Implementation
   1. 9.1 Application Information
   2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
   3. 9.3 Do's and Don'ts
      1. 9.3.1 Soldering
      2. 9.3.2 Recovery From Soldering
      3. 9.3.3 Chemical Exposure
10. 10Power Supply Recommendations
11. 11Layout
    1. 11.1 Layout Guidelines
       1. 11.1.1 Surface Mount
       2. 11.1.2 Stencil Printing Process
    2. 11.2 Layout Example
12. 12器件和文檔支持
    1. 12.1 文檔支持
       1. 12.1.1 相關(guān)文檔　
    2. 12.2 社區(qū)資源
    3. 12.3 商標(biāo)
    4. 12.4 靜電放電警告
    5. 12.5 Glossary
13. 13機(jī)械、封裝和可訂購信息